Two EU directives which are RoHS and WEEE have restricted the usage of certain hazardous substances in
electrical and electronic equipment. This has led to the introduction of green compound which is halogen free. The
non-halogenated molding compound with different recipes was developed by compound manufacturers without
compromising the reliability performance of electronic packages. The focus, often, has been on product reliability
performance while qualifying new materials which overlook relevant safety and health concerns that might incur
during the production stage. This paper is intended to study the forming of crystalline deposits which are found at
the exhaust inlet of the Post Mold Cure Oven (PMC) arising from the usage of this green compound. The writers will
investigate the underlying reasons and the impact on the work environment and the potential risk on health. From the
initial evaluation result, the writers have indentified Compound A as the cause of this deposition. Data analyzed from
the Thermo-Gravimetric Analysis (TGA) revealed higher weight loss which was 0.26% for compound A compared to
other green compounds which are also used. Differential Scanning Calorimetric (DSC) test shows melting temperature
of crystallized particle at 139°C while cold crystallization temperature at 80°C. The temperature in the interior of the
oven is 180°C while the temperature at the exhaust inlet which is exposed to room temperature, and thus, providing
the opportunity for this deposition. Further study carried out using Fourier Transform Infrared (FTIR) spectroscopy
on one of the ingredient of the green compound (material C) observed a 95% spectrum matching compared to the
crystallized particle. Material C is a catalyst added to the mold compound for epoxy-phenolic reaction. It is also
considered to have the capability to enhance flame retardation. This paper will discuss in detail the characteristics of
Compound A green compound and its impact on human and environment.