The investigation of mould inserts in the injection moulding process using metal epoxy composite (MEC) with pure metal filler particles is gaining popularity among researchers. Therefore, to attain zero emissions, the idea of recycling metal waste from industries and workshops must be investigated (waste free) because metal recycling conserves natural resources while requiring less energy to manufacture new products than virgin raw materials would. The utilisation of metal scrap for rapid tooling (RT) in the injection moulding industry is a fascinating and potentially viable approach. On the other hand, epoxy that can endure high temperatures (>220 °C) is challenging to find and expensive. Meanwhile, industrial scrap from coal-fired power plants can be a precursor to creating geopolymer materials with desired physical and mechanical qualities for RT applications. One intriguing attribute of geopolymer is its ability to endure temperatures up to 1000 °C. Nonetheless, geopolymer has a higher compressive strength of 60-80 MPa (8700-11,600 psi) than epoxy (68.95 MPa) (10,000 psi). Aside from its low cost, geopolymer offers superior resilience to harsh environments and high compressive and flexural strength. This research aims to investigate the possibility of generating a new sustainable material by integrating several types of metals in green geopolymer metal composite (GGMC) mould inserts for RT in the injection moulding process. It is necessary to examine and investigate the optimal formulation of GGMC as mould inserts for RT in the injection moulding process. With less expensive and more ecologically friendly components, the GGMC is expected to be a superior choice as a mould insert for RT. This research substantially impacts environmental preservation, cost reduction, and maintaining and sustaining the metal waste management system. As a result of the lower cost of recycled metals, sectors such as mould-making and machining will profit the most.
This manuscript reports the isothermal annealing effect on the mechanical and microstructure characteristics of Sn-0.7Cu-1.5Bi solder joints. A detailed microstructure observation was carried out, including measuring the activation energy of the intermetallic compound (IMC) layer of the solder joints. Additionally, the synchrotron µX-ray fluorescence (XRF) method was adopted to precisely explore the elemental distribution in the joints. Results indicated that the Cu6Sn5 and Cu3Sn intermetallic layers thickness at the solder/Cu interface rises with annealing time at a rate of 0.042 µm/h for Sn-0.7Cu and 0.037 µm/h for Sn-0.7Cu-1.5Bi. The IMC growth's activation energy during annealing is 48.96 kJ mol-1 for Sn-0.7Cu, while adding Bi into Sn-0.7Cu solder increased the activation energy to 55.76 kJ mol-1. The µ-XRF shows a lower Cu concentration level in Sn-0.7Cu-1.5Bi, where the Bi element was well dispersed in the β-Sn area as a result of the solid solution mechanism. The shape of the IMC layer also reconstructs from a scallop shape to a planar shape after the annealing process. The Sn-0.7Cu hardness and shear strength increased significantly with 1.5 wt.% Bi addition in reflowed and after isothermal annealing conditions.