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  1. Aziz MSA, Giribabu N, Rao PV, Salleh N
    Biomed Pharmacother, 2017 May;89:135-145.
    PMID: 28222394 DOI: 10.1016/j.biopha.2017.02.026
    Stingless bee honey (SLBH) has been claimed to possess multiple health benefits. Its anti-diabetic properties are however unknown. In this study, ability of SLBH from Geniotrigona thoracica stingless bee species in ameliorating pancreatic damage and in maintaining metabolic profiles were investigated in diabetic condition.

    METHODS: SLBH at 1 and 2g/kg/b.w. was given orally to streptozotocin (STZ)-nicotinamide-induced male diabetic rats for 28days. Metabolic parameters (fasting blood glucose-FBG and lipid profiles-LP and serum insulin) were measured by biochemical assays. Distribution and expression level of insulin, oxidative stress marker i.e. catalase, inflammatory markers i.e. IKK-β, TNF-α, IL-1β and apoptosis marker i.e. caspase-9 in the pancreatic islets were identified and quantified respectively by immunohistochemistry. Levels of NF-κβ in pancreas were determined by enzyme-linked immunoassay (ELISA).

    RESULTS: SLBH administration to diabetic male rats prevented increase in FBG, total cholesterols (TC), triglyceride (TG) and low density lipoprotein (LDL) levels. However, high density lipoprotein (HDL) and serum insulin levels in diabetic rats receiving SLBH increased. Additionally, histopathological changes and expression level of oxidative stress, inflammation and apoptosis markers in pancreatic islets of diabetic rats decreased with increased expression level of insulin in the islets. LC-MS analysis revealed the presence of several compounds in SLBH that might be responsible for these effects.

    CONCLUSIONS: SLBH has great potential to be used as agent to protect the pancreas against damage and dysfunction where these could account for its anti-diabetic properties.

  2. Alim MA, Abdullah MZ, Aziz MSA, Kamarudin R, Gunnasegaran P
    Polymers (Basel), 2021 Sep 29;13(19).
    PMID: 34641155 DOI: 10.3390/polym13193337
    The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.
  3. Alhajj M, Aziz MSA, Huyop F, Salim AA, Sharma S, Ghoshal SK
    Biomater Adv, 2022 Nov;142:213136.
    PMID: 36206587 DOI: 10.1016/j.bioadv.2022.213136
    This paper reports the characterization and antibacterial performance evaluation of some spherical and stable crystalline silver (Ag)/copper (Cu) nanocomposites (Ag-CuNCs) prepared in deionized water (DIW) using pulse laser ablation in liquid (PLAL) method. The influence of various laser fluences (LFs) on the structural, morphological, optical and antibacterial properties of these NCs were determined. The UV-Vis absorbance of these NCs at 403 nm and 595 nm was gradually increased accompanied by a blue shift. XRD patterns disclosed the nucleation of highly crystalline Ag-CuNCs with their face centered cubic lattice structure. TEM images showed the existence of spherical NCs with size range of 3-20 nm and lattice fringe spacing of approximately 0.145 nm. EDX profiles of Ag-CuNCs indicated their high purity. The antibacterial effectiveness of the Ag-CuNCs was evaluated by the inhibition zone diameter (IZD) and optical density (OD600) tests against Gram-negative (Escherichia coli) and Gram-positive (Staphylococcus aureus) bacteria. The proposed NCs revealed the IZD values in the range of 22-26 mm and 20-25 mm when tested against E. coli and S. aureus bacteria, respectively. The Ag-CuNCs prepared at LF of 14.15 J/cm2 revealed the best bactericidal activity. It is established that by controlling the laser fluence the bactericidal effectiveness of the Ag-CuNCs can be tuned.
  4. Pujiarti H, Pangestu ZA, Sholeha N, Nasikhudin N, Diantoro M, Utomo J, et al.
    Micromachines (Basel), 2023 Feb 04;14(2).
    PMID: 36838094 DOI: 10.3390/mi14020394
    Nanofiber membranes are starting to be used as an electrolyte storage medium because of their high porosity, which causes ionic conductivity, producing high energy. The ability of nanofiber membranes to absorb electrolytes proves their stability when used for a long time. In this study, the loading of acetylene carbon black (ACB) on polyacrylonitrile (PAN) is made by the electrospun method, which in turn is applied as an electrolyte medium in DSSC. Materials characterization was carried out through FTIR to determine the functional groups formed and SEM to observe morphology and diameter distribution. Furthermore, for DSSC performance, efficiency and EIS tests were carried out. The optimum nanofiber membrane was shown by esPACB1, with the highest efficiency reaching 1.92% with a porosity of 73.43%, nanofiber diameter of 172.9 ± 2.2 nm, an absorbance of 1850, and an electron lifetime of 0.003 ms.
  5. Amli SFM, Salleh MAAM, Aziz MSA, Yasuda H, Nogita K, Abdullah MMAB, et al.
    Materials (Basel), 2023 Jun 13;16(12).
    PMID: 37374543 DOI: 10.3390/ma16124360
    The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated. Real-time synchrotron imaging was used to investigate the microstructure, focusing on the in situ growth behavior of primary intermetallics during the solid-liquid-solid interactions. The high-speed shear test was conducted to observe the correlation of microstructure formation to the solder joint strength. Subsequently, the experimental results were correlated with the numerical Finite Element (FE) modeling using ANSYS software to investigate the effects of primary intermetallics on the reliability of solder joints. In the Sn-3.5Ag/Cu-OSP solder joint, the well-known Cu6Sn5 interfacial intermetallic compounds (IMCs) layer was observed in each reflow, where the thickness of the IMC layer increases with an increasing number of reflows due to the Cu diffusion from the substrate. Meanwhile, for the Sn-3.5Ag/ENIG solder joints, the Ni3Sn4 interfacial IMC layer was formed first, followed by the (Cu, Ni)6Sn5 IMC layer, where the formation was detected after five cycles of reflow. The results obtained from real-time imaging prove that the Ni layer from the ENIG surface finish possessed an effective barrier to suppress and control the Cu dissolution from the substrates, as there is no sizeable primary phase observed up to four cycles of reflow. Thus, this resulted in a thinner IMC layer and smaller primary intermetallics, producing a stronger solder joint for Sn-3.5Ag/ENIG even after the repeated reflow process relative to the Sn-3.5Ag/Cu-OSP joints.
  6. Badli-Sham BH, Syafiq MF, Aziz MSA, Mohd Jalil NR, Awang MT, Othman MNA, et al.
    Zookeys, 2023;1157:43-93.
    PMID: 37398628 DOI: 10.3897/zookeys.1157.95873
    Amphibians of Sekayu lowland forest have been studied more than a decade, with discoveries of new records of species showing no sign of abating between the years 2003 to 2020, indicating the remarkably rich diversity of anurans in this forest. Despite ceaseless anthropogenic activities in this area, this study successfully recorded 52 species of amphibians from 32 genera in the lowland forest of Sekayu. The species composition consisted of a single species from the family Ichthyophiidae and 51 species of anurans of 31 genera and six families. The number of species recorded has steadily increased especially during more recent surveys from 2015 to 2020. This study augments the total number of amphibian species recorded from Hulu Terengganu by ten additional species, increasing the total to 70 species for the district.
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