The microstructural evolution of Sn-40Pb/Cu joints has been investigated under 125 o C thermal exposure conditions using single shear lap joints. A scanning electron microscope (SEM) was used to observe the morphology of the phases and energy dispersive x-ray (EDX) was used to estimate the elemental compositions of the phases. A double layer of Cu6Sn5 and Cu3Sn were observed. The Cu6Sn5 developed with a scalloped morphology, while the Cu3Sn always grew as a somewhat undulated planar layer in phase with the Cu6Sn5. The Cu6Sn5 layer began to transform from scallop shape to planar type after aging for 375 hours due to reduction in the interfacial energy. The intermetallic layers showed a linear dependence on the square root of aging time. The growth rate constant of the intermetallic compounds are estimated as 15.2 x 10 - 14 and 0.152 x 10 -14 cm 2 /s for Cu6Sn5 and Cu3Sn intermetallic, respectively.
In this study the intermetallic (IMC) thickness of Sn-Pb, Sn-Zn and Sn-Zn-Bi solders on copper (Cu) substrate were measured at different temperatures using reflow methods. Cu6Sn5 intermetallic phase was detected between Sn-Pb solder and Cu substrate. The J-Cu5Zn8 phase was detected between Sn-Zn and Sn-Zn-Bi lead-free solders with Cu substrate. The thickness of the intermetallics increases with temperature. The IMC thickness for Sn-8Zn-3Bi solder is lower than Sn-9Zn solder for all the soldering temperatures, indicating that Bi has suppressed the initial IMC formation.