Kesan tiubnano karbon (CNT) terhadap pertumbuhan lapisan sebatian antara logam (IMC) bagi sistem pateri bebas
plumbum 96.5Sn-3.0Ag-0.5Cu/substrat Cu telah dikaji. Serbuk aloi Sn-Ag-Cu (SAC305) dicampurkan dengan 0.02 peratus
berat CNT untuk menghasilkan pes pateri SAC305-CNT. Kedua-dua pes pateri SAC305 dan SAC305-CNT dicetak secara
manual di atas permukaan papan litar bercetak (PCB) dengan kemasan kuprum (Cu) menggunakan kaedah percetakan
stensil. Sampel yang telah dicetak dikenakan proses pematerian aliran semula pada suhu 260°C. Sampel yang sudah
terpateri dikenakan ujian penuaan terma selama 200, 400, 600, 800 dan 1000 jam menggunakan ketuhar penyimpanan
suhu tinggi (HTS) pada suhu malar iaitu 150°C. Ketebalan lapisan sebatian antara logam (IMC) diukur menggunakan
alat Pengukuran Fokus Tak Terhingga (IFM®). Keputusan kajian mendapati kadar pertumbuhan lapisan IMC bagi sistem
SAC305/Cu-CNT adalah 25% lebih rendah berbanding dengan sistem SAC/Cu. Maka, dicadangkan bahawa penambahan
CNT boleh merencatkan pertumbuhan lapisan IMC sebanyak 25% akibat penuaan terma.
The microstructure and phase formation of Au-In thin film deposited by e-beam evaporation technique has been studied. Single crystals of rocksalt were used as the substrates. The chamber pressure during deposition was about 2.5 × 10-5 torr and substrate temperature was 35°C. Three types of samples were prepared namely Au, In and Au-In thin films. Microstructure and chemical composition of these thin films were characterized by transmission electron microscopy (TEM) and X-ray photoelectron spectrometer (XPS) respectively. TEM micrograph reveals island structures for both Au and In thin film on the rocksalt substrate, with the In island size distribution is about 9-30 nm compared to Au island in the range of 3-10 nm. The growth of islands instead of smooth film indicates that Au and In thin films follow the Volmer-Weber growth mode. However, island structures were not present on Au-In thin films which most probably follow the Frank van de Merwe growth mode. XPS analysis indicates intermetallic compound was not present in the Au-In thin film suggesting that diffusion process in the interface of Au and In films is minimal.
Tin-lead (SnPb) alloys are widely used in microelectronic packaging industry. It serves as a connector that provide the conductive path needed to achieve the connection from one circuit element to another circuit element. In this research, the effect of gamma irradiation on the micromechanical behaviour of tin-lead (SnPb) solder alloy has been investigated using the nano-indentation testing. Gamma radiation with a Cobalt-60 source were exposed to SnPb solders with different doses from 5 Gy to 500 Gy. In this study, the nano-indentation technique was used to understand the evolution of micromechanical properties (hardness and reduced modulus) of SnPb solder joints subjected to gamma irradiation. The results showed that the hardness of the SnPb alloys was enhanced with increasing of gamma radiation. The hardness was greatest at dose of 500 Gy of sample, 25.6 MPa and had the lowest value at un-irradiated sample. However, the reduced modulus was decreased by increasing the irradiation of gamma due to the intrinsic properties and the atomic bonding of the material.